In semiconductor processing in particular, a completely clean ozone system is required. Any metals and particles emitted from the ozone system onto to the semiconductor surfaces during processing (Wafer/IMEC/RCA/SOM, etc.) affect the quality of the microchip. Including their components – as for example the ozone generator COM-AD or the ozone monitor WM –, the Anseros Water Systems PAP-SC are entirely free of metals in contact with ozone. They are ready for clean wet and dry processing, regardless if with or without acids. To ensure safety, the PAP-SC system includes an ozone destroyer CAT-HO.
APPLICATIONS
+ IMEC and RCA cleaning processes
+ UPW systems
+ Advanced oxidation processes AOP
+ Three phase systems
+ Biodegradation DOC
+ Sterilization
+ Sanitization CIP
TECHNICAL DATA
Gas flow: 100 …. 1000 Nl/h
O3: 100 – 300 g O3/m3
Material in contact with ozone: PFA, quartz